This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal... [more]
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers Flex layer processing and stackup Polyimides... [more]